Description :
•With the miniaturization and versatility of electronic devices, the problems of overheating and the signal interference is increasing. The traditional metal heat sink, the electromagnetic shielding and the absorber could not solve the issues due to cost and space.
•With our new SDM composited material. It is simple and cost-effective to solve the heat issue as well as the EMI problem.
Features：
•Non-metallic material, light weight, high radiation coefficient, high thermal conductivity.
•Easy to mass production, Easy to design special and complex heat dissipation structure parts.
•Excellent anti-interference ability.
•Environmental-friendly materials and production process.
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Applications : Shell and thermal Structure
•Components : ICs，chipsets，CPU，MOS，South Bridge
•LED : Lighting heat sink
•TV : Smart TV / Setop box / OTT
•Networking Device : AP ， Router ， ADSL ， Modern ， CPE
•IOT : IPCAM ， Network appliances
•Power : Power module， Power transistor
•Battery
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Different Materials Comparison :
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